The abstract of this paper (http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=4041869&tag=1) went a little more in detail about Die stacking, which I found really cool. Most importantly that it reduces the "wire distance, latency, and power", and can be used to make high bandwidth/low latency DRAM.
The abstract of this paper (http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=4041869&tag=1) went a little more in detail about Die stacking, which I found really cool. Most importantly that it reduces the "wire distance, latency, and power", and can be used to make high bandwidth/low latency DRAM.