Does any processor use a 3D mesh interconnect? Has it been found to be worse than 2D, or is it more complicated?
metainf
A little searching gives this: http://ieeexplore.ieee.org/document/1502578/ and this: http://ieeexplore.ieee.org/abstract/document/1524203/ and that suggests that a 3D system would have a lot of benefits due to a faster interconnect and lower power usage. However, it seems like there are implementation and scaling problems, due to the fact that there is more heat generated with smaller surface area, which could cause problems.
Does any processor use a 3D mesh interconnect? Has it been found to be worse than 2D, or is it more complicated?
A little searching gives this: http://ieeexplore.ieee.org/document/1502578/ and this: http://ieeexplore.ieee.org/abstract/document/1524203/ and that suggests that a 3D system would have a lot of benefits due to a faster interconnect and lower power usage. However, it seems like there are implementation and scaling problems, due to the fact that there is more heat generated with smaller surface area, which could cause problems.